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Mustafa Kanchwala

Mustafa Kanchwala

Digital ASIC Designer  ·  Computer Architecture  ·  PhD Candidate, University of Toronto

Hi! I'm a digital ASIC and computer architecture engineer focused on energy-efficient hardware for AI, signal processing, and edge-intelligence systems. I am a PhD candidate in the Intelligent Sensory Microsystems Lab at the University of Toronto, advised by Prof. Roman Genov.

Over five years of my PhD, I have worked across the full chip-design stack: defining system architecture, translating algorithms into microarchitecture, writing synthesizable RTL, integrating digital subsystems into mixed-signal SoCs, closing timing, validating on FPGA, and supporting silicon bring-up. Across four 65 nm CMOS tape-outs, I have contributed to streaming data paths, DSP/filtering pipelines, adaptive control, feature extraction, ML inference, packetization, and hardware/software validation.

My strengths are in RTL design, microarchitecture, SoC integration, and ML accelerator design. I enjoy working at the boundary between algorithms and hardware — training and evaluating ML models, understanding their compute and memory requirements, and mapping them into efficient digital architectures for real-time inference. Results published at IEEE ISSCC, VLSI Technology and Circuits, IEEE TBioCAS, and IEEE BioCAS. Recipient of the NSERC PGS-D Scholarship for 2023–2025.

4 Tape-Outs · 65 nm CMOS RTL / Microarchitecture ML Accelerators Computer Architecture SoC Integration FPGA Prototyping IEEE ISSCC · VLSI NSERC PGS-D

News

Jun 2026
Conference Paper accepted at IEEE VLSI 2026. I will be presenting "A Split-Inference Intracortical Interface IC for Battery-Free mm-Scale Magnetoelectrically Powered Brain Implants" at the 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits in Honolulu, Hawaii.
Nov 2025
Demo Demo presented at CMC TEXPO 2025. Presented a live demo of "A Reconfigurable Modular Microelectrode Array Platform for Fast Prototyping of Implantable Closed-Loop Neuromodulation Medical Devices" at the Canadian Microsystems Corporation TEXPO 2025.
Oct 2025
Conference Paper accepted at IEEE BioCAS 2025. Presenting "A Reconfigurable Modular Microelectrode Array Platform for Fast Prototyping of Implantable Closed-Loop Neuromodulation Medical Devices" at the IEEE Biomedical Circuits and Systems Conference in Abu Dhabi, UAE.

Research Highlights

Tape-Out 01 · Neural Sensing SoC

Spatially Zooming ADC Control Logic

Designed low-power digital control logic for adaptive dynamic-range operation of an energy-efficient zooming ADC front-end, featuring three incremental resolution modes for a multi-channel neural sensing SoC. Click to view the same detailed project write-up from the Projects tab.

RTLADC InterfacePost-Silicon
Tape-Out 02 · IEEE ISSCC 2025

Event-Driven Neural Interface SoC

Designed RTL for a scalable mode-switching controller for an inverter-based AFE, a band-pass digital filter, and an area-efficient ML accelerator for event-driven neural signal detection and processing. Enabled best-in-class 10 nW/channel event-driven operation.

ML Accelerator10 nW/chISSCC 2025
Tape-Out 03 · IEEE VLSI 2026

Split-Inference Edge-AI SoC

Led RTL system design and top-level digital integration for a split-inference AI SoC, owning feature extraction, classification, ML processing, digital filtering, control logic, and SoC data-path integration. Accepted at IEEE VLSI 2026.

Split-InferenceBCIVLSI 2026
Tape-Out 04 · Edge AI

Edge AI Accelerator SoC

Designed an Edge AI accelerator and data-path blocks, including a configurable processing element, adaptive AFE mode-switching controller, DSP/filtering pipeline, and data packetization logic. Led digital integration with a custom pad-frame and optimized the data path for efficient wireless transceiver operation.

AI AcceleratorDSPWireless TX

Selected Publications

[C9]
IEEE VLSI 2026
"A Split-Inference Intracortical Interface IC for Battery-Free mm-Scale Magnetoelectrically Powered Brain Implants"
M. Kanchwala et al. — IEEE Symp. VLSI Technology and Circuits, Honolulu, USA, 2026 (Accepted)
[C7]
IEEE ISSCC 2025
"Event-Based Spatially Zooming Neural Interface IC with 10 nW/Input Reconfigurable-Inverter Fabric and Input-Adaptive Quantization"
J. Xu, M. Kanchwala et al. — IEEE ISSCC, San Francisco, CA, USA, 2025
[J2]
IEEE TBIOCAS 2025
"BrainForest: Neuromorphic Multiplier-Less Bit-Serial Weight-Memory-Optimized 1024-Tree Brain-State Classification Processor"
G. O'Leary, J. Koerner, M. Kanchwala, J. S. Filho, T. Valiante, R. Genov — IEEE Trans. Biomed. Circuits Syst., Feb. 2025
[C5]
IEEE ISSCC 2023
"Fascicle-Selective Bidirectional Peripheral Nerve Interface IC with 173 dB FOM Noise-Shaping SAR ADCs and 1.38 pJ/b Frequency-Multiplying Current-Ripple Radio Transmitter"
J. Xu, J. S. Filho, S. Nag, L. Long, C. Tejeiro, E. Hwang, G. O'Leary, Y. Huang, M. Kanchwala et al. — IEEE ISSCC, San Francisco, CA, USA, 2023

Silicon Tape-Outs

Tape-Out 01 · Nov 2021 – Sep 2022

Spatially Zooming ADC Control Logic

65 nm CMOS · Neural Sensing SoC

Designed low-power digital control logic for adaptive dynamic-range operation of an energy-efficient zooming ADC front-end, featuring three incremental resolution modes for a multi-channel neural sensing SoC. Led microarchitecture, RTL, simulation, synthesis, block integration, and post-silicon validation.

RTLSynthesisADC InterfacePost-Silicon
Tape-Out 02 · Sep 2022 – Feb 2025

Event-Driven Neural Interface SoC

65 nm CMOS · IEEE ISSCC 2025

Designed RTL for a scalable mode-switching controller for an inverter-based AFE, a band-pass digital filter, and an area-efficient ML accelerator for event-driven neural signal detection and processing. Enabled best-in-class 10 nW/channel event-driven operation. Published at IEEE ISSCC 2025.

ML AcceleratorDigital Filter10 nW/chISSCC 2025
Tape-Out 03 · Jan 2023 – Jan 2026

Split-Inference Edge-AI SoC

65 nm CMOS · IEEE VLSI 2026

Led RTL system design and top-level digital integration for a split-inference AI SoC, owning feature extraction, classification, ML processing, digital filtering, control logic, and SoC data-path integration. Designed low-power accelerator/control blocks to reduce on-chip compute and off-chip communication energy while preserving real-time inference behavior. Accepted at IEEE VLSI 2026.

Split-InferenceBCIFull-ChipVLSI 2026
Tape-Out 04 · Mar 2025 – Present

Edge AI Accelerator SoC

65 nm CMOS · Edge Inference

Designed an Edge AI accelerator and data-path blocks, including a configurable processing element, adaptive AFE mode-switching controller, DSP/filtering pipeline, and data packetization logic for edge-inference SoC operation. Led digital integration with a custom pad-frame and optimized the data path for efficient wireless transceiver operation.

CNN/TransformerDSP PipelinePad-FrameWireless TX

FPGA & Platform Projects

FPGA / ASIC / PCB · May 2025 – Apr 2026

Split-Inference SoC Real-Time Validation

Zynq FPGA · Custom PCB · On-Chip Inference

Integrated a split-inference Edge AI SoC with a Zynq-based neural recording/stimulation platform, enabling real-time neural-data streaming into the chip's on-chip spike-classification engine and retrieval of inference outputs. Designed Verilog interface/data-path logic and custom PCB for modular chip-to-platform validation; validated the workflow from model pre-training to real-time on-chip classification.

VerilogFPGACustom PCBOn-Chip Inference
FPGA / Embedded Linux · May 2022 – Oct 2025

Reconfigurable Neural Recording & Stimulation Platform

Zynq-7030 · Embedded Linux · Python · IEEE BioCAS 2025

Developed a Zynq-7030 FPGA-based closed-loop validation platform for neural recording and stimulation, connecting custom front-end PCBs, neural interface ASICs, embedded Linux control, and Python-based visualization. Designed RTL streaming pipelines with FIFO buffering, packet formatting, AXI/APB control, and embedded Linux data streaming for real-time acquisition and closed-loop intervention. Published at IEEE BioCAS 2025.

AXI/APBEmbedded LinuxFIFOBioCAS 2025
FPGA / RTL-to-GDSII · Sep 2021 – Jan 2022

NVDLA Accelerator Core with RISC-V

65 nm CMOS · FPGA Emulation · SoC Integration

Integrated NVIDIA's NVDLA open-source ML accelerator core with a PULP/OpenHW Group RISC-V core. Set up FPGA emulation for the RISC-V subsystem prior to synthesis and place-and-route, and explored IP integration, memory mapping, and connectivity challenges for a streamlined accelerator-based SoC integration.

NVDLARISC-VFPGA EmulationSoC Integration
FPGA · Ongoing

RTL Verification & Bring-Up Platforms

Genesys2 · PYNQ-Z1 · Arty-Z7 · SystemVerilog

FPGA-based verification environments for pre-silicon RTL validation of ML accelerator and DSP blocks across all four tape-outs, including stimulus generation, functional coverage, interface emulation, and Python-based post-processing flows for ASIC bring-up support.

SystemVerilogRTL VerificationPythonBring-Up

FPGA platforms used extensively for pre-silicon verification, bring-up support, and rapid prototyping across all four tape-out projects.

Publications

Journal Articles
[J3]
JNER 2026
"Temporal Interference Stimulation of Peripheral Nerves Induces Functionally Diverse Limb Movements Revealed by Automated Pose Estimation and Unsupervised Behavioral Analysis"
J. P. Olorocisimo, S. Nag, H. Zhang, S. Yang, M. Prytula, S. Liu, M. Kanchwala, Y. Sun, J. Zariffa, R. Genov — J. NeuroEngineering Rehabil., Vol. 23, Art. 29, 2026
[J2]
IEEE TBIOCAS 2025
"BrainForest: Neuromorphic Multiplier-Less Bit-Serial Weight-Memory-Optimized 1024-Tree Brain-State Classification Processor"
G. O'Leary, J. Koerner, M. Kanchwala, J. S. Filho, T. Valiante, R. Genov — IEEE Trans. Biomed. Circuits Syst., Feb. 2025
[J1]
IEEE TBCAS 2023
"Fascicle-Selective Ultrasound-Powered Bidirectional Wireless Peripheral Nerve Interface IC"
J. Xu, J. S. Filho, S. Nag, L. Long, E. Hwang, C. Tejeiro, G. O'Leary, Y. Huang, M. Kanchwala, M. Abdolrazzaghi, C. Tang, P. Liu, Y. Sui, H. You, X. Liu, J. Zariffa, R. Genov — IEEE Trans. Biomed. Circuits Syst., Dec. 2023
Conference Papers
[C9]
IEEE VLSI 2026
"A Split-Inference Intracortical Interface IC for Battery-Free mm-Scale Magnetoelectrically Powered Brain Implants"
M. Kanchwala et al. — IEEE Symp. VLSI Technology and Circuits, Honolulu, USA, 2026 (Accepted)
[C8]
IEEE BioCAS 2025
"A Reconfigurable Modular Microelectrode Array Platform for Fast Prototyping of Implantable Closed-Loop Neuromodulation Medical Devices"
M. Kanchwala et al. — IEEE BioCAS, Abu Dhabi, UAE, 2025
[C7]
IEEE ISSCC 2025
"Event-Based Spatially Zooming Neural Interface IC with 10 nW/Input Reconfigurable-Inverter Fabric and Input-Adaptive Quantization"
J. Xu, M. Kanchwala et al. — IEEE ISSCC, San Francisco, CA, USA, 2025
[C6]
IEEE BioCAS 2024
"Multiplierless Spiking Neural Network for Motor Signal Decoding in the Peripheral Nervous System"
Q. Deng, J. Ma, H. Cai, H. You, M. Kanchwala, J. Xu, A. Amirsoleimani, J. Zariffa, R. Genov — IEEE BioCAS, 2024
[C5]
IEEE ISSCC 2023
"Fascicle-Selective Bidirectional Peripheral Nerve Interface IC with 173 dB FOM Noise-Shaping SAR ADCs and 1.38 pJ/b Frequency-Multiplying Current-Ripple Radio Transmitter"
J. Xu, J. S. Filho, S. Nag, L. Long, C. Tejeiro, E. Hwang, G. O'Leary, Y. Huang, M. Kanchwala et al. — IEEE ISSCC, San Francisco, CA, USA, 2023
[C4]
IEEE BioCAS 2023
"Design Methodology for Energy-Constrained AI Edge Inference in Implantable Medical Devices"
J. S. Filho, J. Xu, M. Kanchwala, G. O'Leary, J. Zariffa, R. Genov — IEEE BioCAS, Toronto, ON, Canada, 2023
[C3]
IEEE BioCAS 2023
"Advanced Noise-Shaping SAR ADCs Utilizing Single-Capacitor Arbitrary-Resolution DACs for Miniaturized Neural Interfaces"
J. Xu, S. Wu, H. You, J. S. Filho, M. Kanchwala, R. Genov — IEEE BioCAS, Toronto, ON, Canada, 2023
[C2]
IEEE BioCAS 2023
"Artificially-Intelligent Fascicle-Selective Bidirectional Peripheral Nerve Interfaces"
J. S. Filho, J. Xu, E. Hwang, S. Nag, L. Long, M. Kanchwala, M. Abdolrazzaghi, Y. Huang, J. Zariffa, R. Genov — IEEE BioCAS, Toronto, ON, Canada, 2023
[C1]
IEEE BioCAS 2018
"A Miniature Wireless Neural Recording System for Chronic Implantation in Freely Moving Animals"
M. A. Kanchwala, G. A. McCallum, D. M. Durand — IEEE BioCAS, Cleveland, OH, 2018

Experience

Sep 2021 – Present
Toronto, ON, Canada

PhD Candidate / Digital ASIC Designer

University of Toronto · Intelligent Sensory Microsystems Lab
  • Defined digital subsystem architectures and microarchitecture specifications for low-power Edge AI SoCs, translating sensing, inference, bandwidth, latency, and power requirements into RTL data paths, control sequencing, interfaces, and validation plans.
  • Designed AI-enabled ASIC data paths in 65 nm CMOS, including ML accelerators, DSP/filtering pipelines, adaptive control logic, feature-extraction/classification engines, packetization logic, and top-level SoC integration.
  • Owned PPA-aware implementation across 4 tape-outs, spanning architecture/specification, RTL, simulation, synthesis, timing closure support, SoC integration, chip bring-up, and post-silicon validation.
  • Collaborated with analog, mixed-signal, and RF teams on AMS simulation, interface timing, clock/reset integration, system validation, and silicon bring-up; contributed to publications at IEEE ISSCC, VLSI, TBioCAS, and BioCAS.
Sep 2022 – Apr 2026
Toronto, ON, Canada

Graduate Teaching Assistant

University of Toronto · ECE Department
  • Lead TA for ECE1388 (VLSI Design Methodology, Fall 2022–2025) — a graduate course covering end-to-end ASIC design flow from system architecture and RTL through synthesis, physical design, and GDSII generation. Developed a technical user manual for ASIC design tool setup in Linux, delivered 3-hour RTL-to-GDSII tutorials, and mentored students through final projects.
  • Led tutorials, labs, office hours, and grading for ECE241 (Digital Systems), ECE253 (Digital and Computer Systems), ECE334 (Digital Circuits), ECE342 (Computer Hardware), ECE212 (Circuit Analysis), and ECE110 (Electrical Fundamentals).
Sep 2024 – May 2026
Toronto, ON, Canada

Junior Fellow

Massey College · University of Toronto
  • Executive Member of the House Committee and Co-chair of the Community Service Committee.
Sep 2018 – Aug 2021
Cambridge, MA, USA

Product Engineer, Connected Care – NPI

Philips North America
  • Contributed to design, development, and release of new service solutions and products for the Patient Monitoring NPI portfolio by reviewing requirements, validating test results, and initiating corrective actions.
  • Performed operations audits as lead auditor to ensure compliance to FDA 21CFR820 and ISO13485 regulatory requirements; supported notified body and FDA audits.
  • Collaborated with design and systems engineers to ensure products fulfilled 510(k) submission descriptions.
  • Led multiple continuous improvement and problem-solving projects across business units with cross-functional teams; received Manager Recognition Awards 9 times.
Jan 2016 – Jul 2018
Cleveland, OH, USA

Graduate Student Researcher

Case Western Reserve University · Neural Engineering Center
  • Developed a wireless telemetry system to record data from a chronically implanted device for real-time neural recording and stimulation in a freely moving rat model.
  • Controlled recording and stimulation via BLE; conducted bench testing and acute animal experiments to validate the implant design. Published at IEEE BioCAS 2018.
Jan 2017 – Dec 2017
Highland Heights, OH, USA

Product Engineer – Service Innovations Co-op

Philips North America · Diagnostic Imaging
  • Completed design and validation deliverables for the successful launch of the Vereos PET/CT system.
  • Contributed to product design, manufacturing, installation, and serviceability with a focus on defect identification and risk mitigation.

Education

Expected Jul 2026

PhD, Electrical and Computer Engineering

University of Toronto · Toronto, ON, Canada
GPA 4.0 · Advisor: Prof. Roman Genov
Aug 2018

M.S., Biomedical Engineering

Case Western Reserve University · Cleveland, OH, USA
GPA 4.0 · Advisor: Prof. Dominique M. Durand
May 2013

B.Tech, Electronics and Communication Engineering

Sir Padampat Singhania University · Udaipur, India
Rank 1 in Class · Vice Chancellor's Gold Medal

Technical Skills

RTL & ASIC Design

  • Microarchitecture & RTL Design
  • Computer Architecture
  • DSP / Digital Filtering Pipelines
  • ML / AI Accelerator Design
  • CPU / NPU Architecture
  • SoC / Full-Chip Integration
  • Clock Domain Crossing (CDC)
  • FIFOs / Data Path Design
  • PPA Tradeoff Analysis
  • Timing Closure
  • Post-Silicon Validation

Languages & Tools

  • Verilog / SystemVerilog
  • Python
  • C / C++
  • Tcl / Perl
  • Synopsys Design Compiler, PrimeTime
  • Cadence Innovus, Xcelium, Virtuoso
  • Xilinx/AMD Vivado, Vitis
  • Modelsim

ML & Inference

  • ML Model Training & Evaluation
  • Fixed-Point / Quantized Inference
  • SNN / DNN / CNN / Transformer
  • Neural Decoding Pipelines
  • Edge AI / Real-Time Inference
  • Python Validation Flows

Protocols & Platforms

  • AXI, APB
  • UART, SPI, I2C
  • Embedded Linux
  • Zynq 7020/7030 SoCs
  • PYNQ-Z1, Arty-Z7, Genesys2
  • Custom PCB Design

Teaching

Fall 2022–2025
ECE1388 — VLSI Design Methodology (Lead TA)
Graduate course · End-to-end ASIC design flow: system architecture, RTL, synthesis, physical design, GDSII. Developed a Linux tool-setup manual, delivered 3-hour RTL-to-GDSII tutorials, mentored final projects.
Fall 2023–2025
ECE241 — Digital Systems
Tutorials, labs, office hours, and grading · University of Toronto
Fall 2024–2025
ECE253 — Digital and Computer Systems
Tutorials, labs, office hours, and grading · University of Toronto
Winter 2026
ECE334 — Digital Circuits
Tutorials, labs, office hours, and grading · University of Toronto
Winter 2025
ECE342 — Computer Hardware
Tutorials, labs, office hours, and grading · University of Toronto
Winter 2026
ECE212 — Circuit Analysis
Tutorials, labs, office hours, and grading · University of Toronto
Winter 2024
ECE110 — Electrical Fundamentals
Tutorials, labs, office hours, and grading · University of Toronto
Ongoing
Student Mentorship
Mentored 15 undergrad, 8 MEng, and 2 high school students on ASIC, FPGA, ML, and digital circuit design

Honors & Awards

2023, 2024, 2025
NSERC Postgraduate Doctoral Scholarship (PGS-D)
CAD 101,000 · Natural Sciences and Engineering Research Council of Canada
2025
Frederick Hudd Scholarship
CAD 3,200 · University of Toronto
2018
Certificate of Distinguished Service
Case Western Reserve University
2013
Vice Chancellor's Gold Medal
Rank 1 in Class · Sir Padampat Singhania University
2010, 2012, 2013
Sushila Singhania Academic Scholarship
Rank 1 in Class · Sir Padampat Singhania University

Service & Volunteering

IEEE ISSCC Saratoga Group Volunteer (5 Years) — Technical and presentation support to IEEE ISSCC speakers.

Blog

Notes on research, digital ASIC design, edge-AI hardware, neural interfaces, and the practical thinking behind technical work. The latest Substack posts are pulled into this section automatically and shown newest first.

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